高錦春，教授，博士生導師，工學博士。主要從事電接觸可靠性、無線通信關鍵技術等研究工作。主持完成國家自然科學基金、省部級項目、國際合作，以及企業合作項目等，參與國家重點研發計劃、國家863計劃等項目。曾獲北京市科學技術二等獎，北京市科技進步二等獎，北京市普通高校教學成果二等獎。2009-2010在美國Auburn University做訪問學者從事合作研究工作。

主要研究方向

多環境應力下高頻、高速電接觸故障機理研究與建模，互連多物理場耦合建模與仿真，微互連可靠性研究，射頻連接器無源互調機理研究與建模，材料對無源互調的影響與建模，連接器壽命預測，以及電接觸相關的電磁兼容問題研究等。

代表性成果

[1] L. Bi, J. Gao, G. T. Flowers, Z. Wang, J. Luo, W. Wang, Impact of Multiple Insertions and Withdrawals, and Vibration on Passive Intermodulation in Coaxial Connectors, IEEE Transactions on Microwave Theory and Techniques, vol.71, no.2, pp 488-499, 2023.

[2] K. Song, J. Gao, G. T. Flowers, Z. Wang, C. Wang, W. Yi, Z. Cheng, The Impact of the Connection Failure of Ground Solder Balls on Digital Signal Waveform, IEEE Transactions on Electromagnetic Compatibility, vol. 65, no.1, pp 312-322, 2023.

[3] Z. Wang, J. Gao, W. Wang, H. M. Bilal, Y. Wu, C. Wang, The Impact of Gold Plating Process for Bonding Pads on Interconnection Quality, IEEE Transactions on Device and Materials Reliability, vol. 22, no.1, pp 65-72, 2022.

[4] K. Song, J. Gao, G. T. Flowers, Z. Wang, W. Yi, Z. Cheng, Modeling and Analysis of Signal Integrity of Ball Grid Array Packages with Failed Ground Solder Balls, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.12, no. 2, pp 306-315, 2022.

[5] W. Wang, J. Gao, G. T. Flowers, Z. Wang, L. Bi, H. M. Bilal, Modeling of the Signal Transmission of a Coaxial Connector With a Degraded Dielectric Layer in a Humid Environment, IEEE Transactions on Dielectrics and Electrical Insulation, vol.29, no.4, pp 1522-1529, 2022.

[6] L. Bi, J. Gao, G. T. Flowers, G. Xie, Q. Jin, Modeling of Signal Distortion Caused by Passive Intermodulation and Cross Modulation in Coaxial Connectors, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.11, no.2, pp.284-293, 2021.

[7] Z. Wang, J. Gao, G. T. Flowers, W. Yi, Y. Wu, Z. Cheng, The Impact of Connection Failure of Bonding Wire on Signal Transmission in Radio Frequency Circuits, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.10, no.10, pp. 1729-1737, 2020

[8] Q. Jin, J. Gao, G. T. Flowers, Y. Wu, G. Xie and L. Bi, Modeling of Passive Intermodulation in Connectors With Coating Material and Iron Content in Base Brass, IEEE Transactions on Microwave Theory and Techniques, vol. 67, no. 4, pp. 1346-1356, 2019.

[9] Q. Li, J. Gao, G. T. Flowers, G. Xie, and R. L. Jackson, Effect of Electrical Contact Degradation on Analog Signal Transmission”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 12, pp. 2374-2382, 2019.

[10] Q. Jin, J. Gao, G. T. Flowers, Y. Wu, and G. Xie, Modeling of Passive Intermodulation With Electrical Contacts in Coaxial Connectors, IEEE Transactions on Microwave Theory and Techniques, vol. 66, no. 9, pp. 4007-4016, 2018.